Alleged logic diagram of the upcoming iPhone 6S revealed

Much has been announced about the arrival of the next generation of Apple devices . However, images have just been released showing the logic boards of the supposed iPhone 6S ; through a diagram, it also reveals the integration of a new SiP (System-in-Package) in the design.

And although the presentation of the new devices has not yet been officially confirmed, according to China Times, the launch will take place on September 18th.

 

On the other hand, it was also reported that the new iPhone 6S and iPhone 6S Plus would feature improvements to their internal design. In addition to integrating the new SiP technology , they would also include a 12-module A9 chip , 2GB of RAM , double the LTE speed , a Force Touch touchscreen , and a 12-megapixel rear camera capable of recording 4K video and slow-motion video at 240 fps.

However, delving a little deeper into the production of these new devices, we find that several sources close to the company have already confirmed that the development of the new iPhone 6S and iPhone 6S Plus began in June.

Therefore, the first batch of the new devices should be ready for stores in the US by September. For other countries, availability is expected to take until approximately September 26th.

And although nothing has been officially confirmed yet, all we can do is wait. We'll see Apple unveil its new iPhone 6S and iPhone 6S Plus , its new Apple TV , and also present the updated iPad Air 3.