TSMC will produce fingerprint sensors for the next generation of iPhones

TSMC reports that it will begin producing fingerprint sensors for Apple's next iPhone , which is rumored to be a 12 -inch device that will also feature a 65nm processor in 2014.

To ensure the performance rates of the new fingerprint sensors, Taiwan Semiconductor Manufacturing Company (TSMC) is also expected to handle the disk-scale chip-level packaging (WL-CSP) process itself, instead of outsourcing the IC packaging process, which was done previously.

Let's remember that TSMC has been manufacturing the fingerprint sensors for the iPhone 5S in its 8-inch factories , while outsourcing backend services to Xintec, China Wafer Level CSP and Advanced Semiconductor Engineering (ASE).

On the other hand, and due to limited packaging capacity, TSMC may shift some of the packaging orders for Qualcomm's chips to STATS ChipPAC, the sources added.

Meanwhile, TSMC will also begin producing application processors for Apple soon, using a 20nm process, given that production of the hotspots ramped up significantly starting in the third quarter.

Let's wait and see what other news comes out about the next iPhone that the Cupertino company plans to launch this year, 2014.